Intern - Signal and Power Integrity Engineer

Job Description:   

As a Signal Integrity (SI) Engineer at Micron Technology Inc., you will be responsible for working with the Signal Integrity Research and Development (SI R&D) team as it supports all of Micron’s current and future product developments.  Major product technologies developed at Micron include but not limited to DRAM, LPDRAM, RLDRAM, NAND, NOR, 3DXP, HBM and Solid-State Drives (SSDs) within the consumer, server, wireless, and embedded product groups.  A major SI R&D team focus is integrated circuit packaging.  The team owns all steps of the signal and power integrity support process including die and package model generation, product performance analysis, system-level SI evaluation, measurement, correlation, and customer support.  The team also supports future specification development within several industry standards groups including JEDEC, ONFI, and IBIS.  The group working environment is diverse, challenging, and team oriented.  This position requires a self-motivated - candidate who enjoys leading and taking ownership of assigned projects, can exhibit good written and verbal communication skills, and can work well in a diverse team environment.

You will alternate through different product development teams, contributing in SI/PI (power integrity) development to ensure product electrical performance through modeling, simulation, analysis, and correlation of the integrated circuit packages.  You will be responsible for representing the SI R&D team and integrating with package design, silicon design, product engineering, and marketing departments to ensure overall product performance.  You will also be expected to contribute to future standards development efforts through system and product electrical capability exploration.  Additional responsibilities include external customer support and group methodology development.  You will be supporting senior engineers in their work for all of the above.

Qualifications

You will have:

• BSEE w/ 3 years minimum relevant industry experience (or equivalent degrees; MSEE)
• Required courses covering electromagnetic, transmission line and RF theory, analog design or similar fields of study or experience.
• Required experience and working knowledge of E.M. field solvers (quasi-static and full wave), time and frequency domain simulation tools like Q3D, SIWAVE, HFSS, HSPICE, ADS, etc..
• Sound understanding of electromagnetic and transmission line theory, general I/O design, signal integrity, differential and single-ended interface technologies.
• Knowledgeable about Printed Circuit Board (PCB) layout or electrical package design techniques.
• Working knowledge of design and analysis of high-speed single-ended or differential buses.
• Familiarity and fundamental understanding of lab measurement equipment like Oscilloscopes, TDR, Vector Network Analyzer (VNA), etc.
• Familiarity with statistical analysis and equivalent tools (example: JMP) is also beneficial or plus.
• Ambitious candidate should enjoy leading and taking ownership of assigned projects, exhibit good written and verbal interpersonal skills, and have the ability to work well in a team with varied strengths.